TWO MORE CHECKMARKS ON THE SRG DRIVE TEST BUCKET LIST
LTE TDD and LTE Advanced Carrier Aggregation LIVE
Pages: 18 | Price: $0.00
Signals Research Group (SRG) just returned from a ten day self-sponsored road trip to Asia during which time we had the opportunity to drive test LTE TDD (Japan) and the Carrier Aggregation feature of LTE Advanced Release 10 (South Korea). For these tests we used the Accuver XCAL drive test solution and XCAP post-processing soft- ware which support the recent technology innovations that the two networks have undergone. Later this fall we will be coming out with our typical in-depth analysis of network/technology performance. These forthcoming reports are included as part of a corporate subscription to Signals Ahead or they can be purchased on an individual basis. We include special pricing information for these two reports.
SETTING THE STAGE FOR LTE-ADVANCED AND CARRIER AGGREGATION
SETTING THE STAGE FOR LTE-ADVANCED AND CARRIER AGGREGATION plus updates following the LTE World Summit
Pages: 17 | Price: $0.00
Last week we attended the LTE World Summit in Amsterdam. In this special issue of Signals Flash! we provide some highlights and key takeaways from the event. Apologies for being late on our next Signals Ahead report, but we’ve got numerous things in the works – just nothing ready to print. A pending trip to the East where we plan to dine on Bee-Bim Bop along with doing other activities that should be of more interest to our readers won’t help matters any…
MOBILE WORLD CONGRESS 2013
Things we learned, ate and drank
Pages: 15 | Price: $0.00
Following this year’s MWC we offer the following key takeaways in an abbreviated format. We discuss each bullet point in more detail on the subsequent pages. In future editions of our subscription-based Signals Ahead reports we plan to delve far deeper into some of these topics.
Addressing a Huge Opportunity and a Critical Market Requirement…
...while extending its tentacles into uncharted territories
Pages: 13 | Price: $0.00
Qualcomm announced its entry into the RF front-end (RFFE) market with a suite of new [CMOS] products and a new manufacturing/packaging process called RF POPTM.